HY510 - Thermal paste Injection
Non-returnable
Rs.159.00
HY510 Thermal Grease Injection is a thermal compound used to improve the thermal interface between electronic components and heatsinks or heat spreaders, promoting efficient heat transfer and cooling. It is commonly used in computer building, maintenance, and overclocking, as well as in various industrial applications where heat management is essential. Proper application and mounting are crucial for achieving the best results.
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Product Details
This is a syringe of heatsink compound (aka thermal grease, thermal paste). Use this whenever you're connecting a component to a heatsink, the Thermal paste dissipates even more potentially damaging heat.
This compound is composed of 50% silicone, 20% carbon, and 30% metal oxide. It has a good thermal conductivity, which should be plenty for voltage regulators, MOSFETs, motor drivers, audio amplifiers, etc.
Generally used as a thermal coupling of electrical / electronic devices to heat sinks such as base or mounting studs of transistors, diodes and rectifiers
It is used for maintaining a positive heat-sink seal that improves heat transfer from the electrical / electronic component / device to the heat sink or chassis, there by increasing the overall efficiency of the component / device
High thermal conductivity low thermal resistance electrically non-conductive, non-curing, non-capacitive, non-corrosive bleed resistant temp resistant from -50 to 210 C
Package included 1 piece, Weight : Approx. 30 g,
Material : Heat Sink Compound. Colour : Grey,
High Grade Stability And Reliability.
Apply to CPU, VGA, Chipset, Radiator And Other PC Components.
Helps Disperse The Heat From CPU To Heatsink Effectively.
Low Thermal Resistance And High Conductivity For Superior Heat Transfer.
High Temperature Resistance. Non-toxic, Tasteless, Non-corrosive.
Specifications:
1. Thermal conductivity = >1.9W/m-K
2. Thermal Impedance = <0.225°C-in2/W
3. Gravity = >2.0g/cm3
4. Viscosity = 1000
5. Thixotropic Index = 380±10 1/10mm
6. Operation Temperature(Peak) = -30~300°C
7. Moment Bore Temperature = -50~300°C